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Title: Tensile and Tensile-Mode Fatigue Testing of Microscale Specimens in Constant Humidity Environment
Authors: Tsuchiya, T.  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0002-7846-5831 (unconfirmed)
Yamaji, Y.
Sugano, K.
Tabata, O.  KAKEN_id
Author's alias: 土屋, 智由
Keywords: Microelectromechanical systems
Microscale specimen
Tensile-mode fatigue test
Humidity control
Single crystal silicon
Issue Date: Apr-2010
Publisher: Springer
Journal title: Experimental Mechanics
Volume: 50
Issue: 4
Start page: 509
End page: 516
Abstract: A tensile and tensile-mode-fatigue tester has been developed for testing microscale specimens in high humidity environments in order to investigate the fracture mechanisms of microelectromechanical materials. A humidity control system was installed on a tensile-mode fatigue tester equipped with an electrostatic force grip. A specimen and a griping device were inserted into a small chamber and the humidity was controlled by air flow from a temperature and humidity chamber. The humidity stability was within ±2%RH for humidities in the range 25–90%RH for eight hours of testing. Fatigue tests were performed on single-crystal silicon (SCS) specimens in constant humidity environments and laboratory air for up to 106 cycles. The gauge length, width, and thickness of the SCS specimens were 100 or 500 μm, 13.0 μm, and 3.3 μm, respectively. The average tensile strength was 3.68 GPa in laboratory air; this value decreased in high humidity environments. Fatigue failure was observed during cyclic loading at stresses lower than the average strength. A reduction in the fatigue strength was observed at high relative humidities. Different fracture origins and fracture behaviors were observed in tensile tests and fatigue tests, which indicates that the water vapor in air affects the fatigue properties of SCS specimens.
Rights: The original publication is available at www.springerlink.com
This is not the published version. Please cite only the published version.
この論文は出版社版でありません。引用の際には出版社版をご確認ご利用ください。
URI: http://hdl.handle.net/2433/120793
DOI(Published Version): 10.1007/s11340-009-9258-1
Appears in Collections:Journal Articles

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