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タイトル: Preparation of Cu-Sn Layers on Polymer Substrate by Reduction-Diffusion Method Using Ionic Liquid Baths
著者: Murase, Kuniaki  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0002-7564-9416 (unconfirmed)
Ito, Akira
Ichii, Takashi  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0002-4021-8894 (unconfirmed)
Sugimura, Hiroyuki  KAKEN_id
著者名の別形: 邑瀬, 邦明
伊藤, 輝
一井, 崇
杉村, 博之
キーワード: copper alloys
electrochemistry
electroless deposition
metallisation
tin alloys
発行日: 2011
出版者: The Electrochemical Society
誌名: Journal of The Electrochemical Society
巻: 158
号: 6
開始ページ: D335
終了ページ: D341
抄録: A novel metallization of non-conductive epoxy substrate with Cu-Sn “speculum alloy, ” or “white bronze, ” was performed through successive electrochemical processes: (i) conventional electroless deposition of pure Cu layer and (ii) subsequent electrochemical alloying of the resulting pure Cu layer with Sn using an ionic liquid bath at 150°C, a medium-low temperature. Availability of the Sn quasi-reference electrode for the alloying was verified, and the resulting compact and adhesive Cu-Sn layers, composed of Cu6Sn5 and/or Cu3Sn intermetallic phases, were examined as an alternative to nickel plating. The abundance of the two intermetallic phases was found to be dependent on the alloying potential and duration, and was discussed in terms of alloy formation thermodynamics of the Cu-Sn system.
著作権等: © 2011 ECS - The Electrochemical Society
URI: http://hdl.handle.net/2433/159459
DOI(出版社版): 10.1149/1.3573984
出現コレクション:学術雑誌掲載論文等

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