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Title: | Analytical investigation of the feasibility of sacrificial microchannel sealing for Chip-Scale Atomic Magnetometers |
Authors: | Tsujimoto, Kazuya Hirai, Yoshikazu ![]() ![]() ![]() Sugano, Koji Tsuchiya, Toshiyuki ![]() ![]() ![]() Tabata, Osamu ![]() |
Author's alias: | 辻本, 和也 田畑, 修 |
Issue Date: | Mar-2014 |
Publisher: | Springer Berlin Heidelberg |
Journal title: | Microsystem Technologies |
Volume: | 20 |
Issue: | 3 |
Start page: | 357 |
End page: | 365 |
Abstract: | An alkali metal vapor cell is a crucial component of the highly sensitive Chip Scale Atomic Magnetometers (CSAMs) that are increasingly deployed in a variety of electronic devices. Herein, we propose a novel microfabrication technique utilizing an array of microchannels at a bonded interface, to enable gas feedthrough for evacuation of unwanted gases from a vapor cell and subsequent introduction of an inert gas, followed by permanent sealing of the microchannels by reflow of a glass frit. The characteristics of glass frit reflow are analyzed to investigate the feasibility of using microchannels formed either on a silicon substrate, or embedded in a glass frit layer, with four different cross-sectional shapes considered. Prior to modeling the microchannels for simulation, the minimum cross-sectional size of a microchannel that fulfills gas feedthrough requirements was calculated and a value of 10 μm was determined based on a flow conductance model. The sealing of the microchannels was simulated using the finite element method (FEM) and the results revealed that flow resistance is a crucial design factor. Thus, embedded microchannel designs were more suitable for the proposed sealing technique than microchannel designs fabricated in silicon. |
Rights: | The final publication is available at Springer via http://dx.doi.org/10.1007/s00542-013-1895-8. This is not the published version. Please cite only the published version. この論文は出版社版でありません。引用の際には出版社版をご確認ご利用ください。 |
URI: | http://hdl.handle.net/2433/199891 |
DOI(Published Version): | 10.1007/s00542-013-1895-8 |
Appears in Collections: | Journal Articles |

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