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| ファイル | 記述 | サイズ | フォーマット | |
|---|---|---|---|---|
| 2.0871910jes.pdf | 1.7 MB | Adobe PDF | 見る/開く |
| タイトル: | Cyanide-Free Displacement Silver Plating Using Highly Concentrated Aqueous Solutions of Metal Chloride Salts |
| 著者: | Adachi, Ken Kitada, Atushi Fukami, Kazuhiro    https://orcid.org/0000-0001-9120-5578 (unconfirmed)Murase, Kuniaki https://orcid.org/0000-0002-7564-9416 (unconfirmed) |
| 著者名の別形: | 北田, 敦 深見, 一弘 邑瀬, 邦明 |
| キーワード: | Electrodeposition - electroless Concentrated aqueous solution Electroless deposition Silver plating |
| 発行日: | 11-Jun-2019 |
| 出版者: | The Electrochemical Society |
| 誌名: | Journal of The Electrochemical Society |
| 巻: | 166 |
| 号: | 10 |
| 開始ページ: | D409 |
| 終了ページ: | D414 |
| 抄録: | We report a novel, cyanide-free, and low-cost displacement silver (Ag) plating bath, i.e., AgCl-dissolved highly concentrated CaCl2/LiCl aqueous solution. Compared to dilute CaCl2/LiCl solutions, this aqueous solution exhibited much higher AgCl solubility because of the high activity of Cl–; the maximum AgCl solubility was achieved at 44.4 mmol dm–3 (i.e., [Ag(I)] = 8.07 g kg−1 H2O). Smooth Ag deposits with a lusterless gray-colored appearance were successfully obtained by displacement plating on a Cu substrate. The mechanism of smooth Ag plating is discussed in terms of its electrochemical and diffusive properties. |
| 著作権等: | © The Author(s) 2019. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited. |
| URI: | http://hdl.handle.net/2433/241762 |
| DOI(出版社版): | 10.1149/2.0871910jes |
| 出現コレクション: | 学術雑誌掲載論文等 |
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