このアイテムのアクセス数: 316
このアイテムのファイル:
| ファイル | 記述 | サイズ | フォーマット | |
|---|---|---|---|---|
| 2.0871910jes.pdf | 1.7 MB | Adobe PDF | 見る/開く |
| タイトル: | Cyanide-Free Displacement Silver Plating Using Highly Concentrated Aqueous Solutions of Metal Chloride Salts |
| 著者: | Adachi, Ken Kitada, Atushi Fukami, Kazuhiro    https://orcid.org/0000-0001-9120-5578 (unconfirmed)Murase, Kuniaki https://orcid.org/0000-0002-7564-9416 (unconfirmed) |
| 著者名の別形: | 北田, 敦 深見, 一弘 邑瀬, 邦明 |
| キーワード: | Electrodeposition - electroless Concentrated aqueous solution Electroless deposition Silver plating |
| 発行日: | 11-Jun-2019 |
| 出版者: | The Electrochemical Society |
| 誌名: | Journal of The Electrochemical Society |
| 巻: | 166 |
| 号: | 10 |
| 開始ページ: | D409 |
| 終了ページ: | D414 |
| 抄録: | We report a novel, cyanide-free, and low-cost displacement silver (Ag) plating bath, i.e., AgCl-dissolved highly concentrated CaCl2/LiCl aqueous solution. Compared to dilute CaCl2/LiCl solutions, this aqueous solution exhibited much higher AgCl solubility because of the high activity of Cl–; the maximum AgCl solubility was achieved at 44.4 mmol dm–3 (i.e., [Ag(I)] = 8.07 g kg−1 H2O). Smooth Ag deposits with a lusterless gray-colored appearance were successfully obtained by displacement plating on a Cu substrate. The mechanism of smooth Ag plating is discussed in terms of its electrochemical and diffusive properties. |
| 著作権等: | © The Author(s) 2019. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited. |
| URI: | http://hdl.handle.net/2433/241762 |
| DOI(出版社版): | 10.1149/2.0871910jes |
| 出現コレクション: | 学術雑誌掲載論文等 |
このリポジトリに保管されているアイテムはすべて著作権により保護されています。