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タイトル: 銅電解アノードスライムからの高濃度塩酸および過酸化水素を用いた金の選択浸出
その他のタイトル: Selective Leaching of Gold from Copper Anode Slime Using Concentrated Hydrochloric Acid and Hydrogen Peroxide
著者: MIYAKE, Masao  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0001-8208-4030 (unconfirmed)
ISHII, Toshimasa
YAMAGAMI, Kei
HIRATO, Tetsuji  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0003-3030-1632 (unconfirmed)
著者名の別形: 三宅, 正男
石井, 俊匡
山上, 慶
平藤, 哲司
キーワード: 選択浸出
貴金属
過酸化水素
アノードスライム
Selective Leaching
Precious Metal
Hydrogen Peroxide
Anode Slime
発行日: 31-Dec-2019
出版者: Mining and Materials Processing Institute of Japan
誌名: Journal of MMIJ
巻: 135
号: 12
開始ページ: 109
終了ページ: 115
抄録: Leaching of copper anode slime using hydrochloric acid (HCl) and hydrogen peroxide (H₂O₂) is performed to recover Au. It is imperative to reduce the amount of the costly oxidizing agent, H₂O₂, used in this leaching. In conventional conditions, the Se contained in the slime is oxidized and dissolved by the leachant as well as Au. If Au alone can be selectively leached, it should reduce the use of H₂O₂. The calculation of equilibrium potentials showed that when the concentration of HCl is high, it is possible for Au to be selectively leached, while the dissolution of Se is suppressed. The selective leaching of Au was demonstrated by experiments using 8 mol L⁻¹ and 12 mol L⁻¹ HCl solutions with various amounts of added H₂O₂. In the selective leaching, the increase in the leaching rate of Au with increasing amounts of H₂O₂ diminished after the leaching rate reached 80%. This may be because Au remained inside the Se particles, and the contact between Au and the leachant was physically inhibited by the Se layer encompassing the Au atoms. However, a leaching rate of Au of greater than 95% was achieved, even when the leaching rate of Se was less than 30%. From these results, it was confirmed that the use of H₂O₂ can be reduced by the selective leaching of Au compared to the cases in which all Se in the slime is dissolved.
著作権等: Creative Commons Licenseのもとに公開されている論文です。
URI: http://hdl.handle.net/2433/259836
DOI(出版社版): 10.2473/journalofmmij.135.109
出現コレクション:学術雑誌掲載論文等

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