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j.matlet.2020.129245.pdf | 607.17 kB | Adobe PDF | 見る/開く |
タイトル: | Dissimilar joining of alumina to aluminum at room temperature without applying a loading by two-step deposition |
著者: | Naito, Koji Deguchi, Soichiro Hakamada, Masataka https://orcid.org/0000-0002-8082-2148 (unconfirmed) Mabuchi, Mamoru https://orcid.org/0000-0002-0894-6306 (unconfirmed) |
著者名の別形: | 内藤, 江児 出口, 総一郎 袴田, 昌高 馬渕, 守 |
キーワード: | Joining Aluminum Alumina Electrodeposition Electroless deposition |
発行日: | 1-Mar-2021 |
出版者: | Elsevier BV |
誌名: | Materials Letters |
巻: | 286 |
論文番号: | 129245 |
抄録: | Low temperature joining is desirable for aluminum-ceramics joining because aluminum has a large coefficient of thermal expansion. In the present work, joining of Al₂O₃ to Al was performed at room temperature by the two-step deposition method including Ni electroless deposition and Cu electrodeposition. The joining strength was increased, and the fracture mode changed from a fracture at the Ni/Al₂O₃ interface to that in the Al₂O₃ substrate by using a porous Al₂O₃ or by etching a dense Al₂O₃ surface. Thus, the present work demonstrates that Al₂O₃ and Al are successfully joined at room temperature without applying a load by the deposition method. |
著作権等: | © 2020. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/ The full-text file will be made open to the public on 1 March 2023 in accordance with publisher's 'Terms and Conditions for Self-Archiving' This is not the published version. Please cite only the published version. この論文は出版社版でありません。引用の際には出版社版をご確認ご利用ください。 |
URI: | http://hdl.handle.net/2433/261745 |
DOI(出版社版): | 10.1016/j.matlet.2020.129245 |
出現コレクション: | 学術雑誌掲載論文等 |
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