Direct Semiconductor Wafer Bonding in Non-Cleanroom Environment: Understanding the Environmental Influences on Bonding

Abstract

We investigated semiconductor direct wafer bonding in a regular, non-cleanroom environment to understand environmental influences on bonding characteristics. The correlations among surface treatments, particle densities, bonding strengths, and interfacial conductivities were systematically investigated. On the basis of our investigation and condition optimization, we realized direct semiconductor bonding in the regular atmosphere with high interfacial mechanical stabilities and electrical conductivities, sufficient for device applications. Furthermore, we demonstrated fabrication and operation of solar cells using the developed bonding technique, with current paths across the bonded interfaces. These results and related technical insights may be useful for a low-cost, simpler manufacture of high-performance electrical and optical devices.