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タイトル: | Thermodynamic Design of Electrolyte for CuO/Cu₂O Bilayer by Anodic Electrodeposition |
著者: | Miura, Ryutaro Kitada, Atsushi https://orcid.org/0000-0002-4387-8687 (unconfirmed) Fukami, Kazuhiro https://orcid.org/0000-0001-9120-5578 (unconfirmed) Murase, Kuniaki https://orcid.org/0000-0002-7564-9416 (unconfirmed) |
著者名の別形: | 三浦, 隆太郎 北田, 敦 深見, 一弘 邑瀬, 邦明 |
発行日: | Jun-2021 |
出版者: | The Electrochemical Society IOP Publishing Limited |
誌名: | Journal of The Electrochemical Society |
巻: | 168 |
号: | 6 |
論文番号: | 062506 |
抄録: | Electrodeposition of multilayered semiconductors requires a bath design to electrodeposit the upper layer(s) without dissolving the base layer(s) below. We present herein a reliable approach to bath design based on thermodynamics from the viewpoint of complexation with ligands. A CuO/Cu₂O bilayer film was targeted as an example. We searched a thermodynamic database of complexation constants for ligands that could form a complex with Cu(II) but not with Cu(I), and identified monoethanolamine as one of the best candidates. Using a Cu(II)-monoethanolamine alkaline aqueous bath, we experimentally confirmed that a CuO upper layer could be deposited without dissolving the Cu₂O base layer. We believe that this design is applicable to other bilayer films produced by electrochemical techniques. |
著作権等: | © 2021 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited. |
URI: | http://hdl.handle.net/2433/276634 |
DOI(出版社版): | 10.1149/1945-7111/ac064c |
出現コレクション: | 学術雑誌掲載論文等 |
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