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タイトル: Modeling of DNA binding to the condensin hinge domain using molecular dynamics simulations guided by atomic force microscopy
著者: Koide, Hiroki
Kodera, Noriyuki
Bisht, Shveta
Takada, Shoji  kyouindb  KAKEN_id
Terakawa, Tsuyoshi  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0002-0151-1123 (unconfirmed)
著者名の別形: 小出, 洋輝
高田, 彰二
寺川, 剛
キーワード: Crystal structure
Biochemical simulations
Biophysical simulations
Protein structure prediction
Electrostatics
Saccharomyces cerevisiae
Atomic force microscopy
Protein structure
発行日: Jul-2021
出版者: Public Library of Science (PLoS)
誌名: PLOS Computational Biology
巻: 17
号: 7
論文番号: e1009265
抄録: The condensin protein complex compacts chromatin during mitosis using its DNA-loop extrusion activity. Previous studies proposed scrunching and loop-capture models as molecular mechanisms for the loop extrusion process, both of which assume the binding of double-strand (ds) DNA to the hinge domain formed at the interface of the condensin subunits Smc2 and Smc4. However, how the hinge domain contacts dsDNA has remained unknown. Here, we conducted atomic force microscopy imaging of the budding yeast condensin holo-complex and used this data as basis for coarse-grained molecular dynamics simulations to model the hinge structure in a transient open conformation. We then simulated the dsDNA binding to open and closed hinge conformations, predicting that dsDNA binds to the outside surface when closed and to the outside and inside surfaces when open. Our simulations also suggested that the hinge can close around dsDNA bound to the inside surface. Based on these simulation results, we speculate that the conformational change of the hinge domain might be essential for the dsDNA binding regulation and play roles in condensin-mediated DNA-loop extrusion.
著作権等: © 2021 Koide et al.
This is an open access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
URI: http://hdl.handle.net/2433/276673
DOI(出版社版): 10.1371/journal.pcbi.1009265
PubMed ID: 34329301
出現コレクション:学術雑誌掲載論文等

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