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タイトル: Mechanical reliability of silicon microstructures
著者: Tsuchiya, Toshiyuki
著者名の別形: 土屋, 智由
キーワード: silicon
mechanical reliability
strength
fatigue
発行日: Jan-2022
出版者: IOP Publishing
誌名: Journal of Micromechanics and Microengineering
巻: 32
号: 1
論文番号: 013003
抄録: In this article, an overview of the mechanical reliability of silicon microstructures for micro-electro-mechanical systems is given to clarify what we now know and what we still have to know about silicon as a high-performance mechanical material on the microscale. Focusing on the strength and fatigue properties of silicon, attempts to understand the reliability of silicon and to predict the device reliability of silicon-based microstructures are introduced. The effective parameters on the strength and the mechanism of fatigue failure are discussed with examples of measurement data to show the design guidelines for highly reliable silicon microstructures and devices.
著作権等: This is the Accepted Manuscript version of an article accepted for publication in [Journal of Micromechanics and Microengineering]. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/1361-6439/ac3cd6.
CC BY-NC-ND licence
The full-text file will be made open to the public on 9 December 2022 in accordance with publisher's 'Terms and Conditions for Self-Archiving'.
This is not the published version. Please cite only the published version. この論文は出版社版でありません。引用の際には出版社版をご確認ご利用ください。
URI: http://hdl.handle.net/2433/284806
DOI(出版社版): 10.1088/1361-6439/ac3cd6
出現コレクション:学術雑誌掲載論文等

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