Downloads: 48

Files in This Item:
File Description SizeFormat 
5.0162610.pdf5.85 MBAdobe PDFView/Open
Title: Impact of the oxidation temperature on the density of single-photon sources formed at SiO₂/SiC interface
Authors: Kaneko, Mitsuaki  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0001-5629-0105 (unconfirmed)
Takashima, Hideaki
Shimazaki, Konosuke
Takeuchi, Shigeki  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0001-7731-003X (unconfirmed)
Kimoto, Tsunenobu  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0002-6649-2090 (unconfirmed)
Author's alias: 金子, 光顕
髙島, 秀聡
嶋崎, 幸之介
竹内, 繁樹
木本, 恒暢
Keywords: Semiconductor devices
Microfabrication
Confocal microscopy
Crystallographic defects
Photoluminescence spectroscopy
Optical metrology
Issue Date: Sep-2023
Publisher: AIP Publishing
Journal title: APL Materials
Volume: 11
Issue: 9
Thesis number: 091121
Abstract: The impact of oxidation temperature on the formation of single photon-emitting defects located at the silicon dioxide (SiO₂)/silicon carbide (SiC) interface was investigated. Thermal oxidation was performed in the temperature range between 900 and 1300 °C. After oxidation, two different cooling processes—cooling down in N₂ or O₂ ambient—were adopted. Single photon emission was confirmed with second-order correlation function measurements. For the samples cooled in an N₂ ambient, the density of interface single photon sources (SPSs) increased with decreasing oxidation temperature with a density that could be controlled over the 10⁵ to 10⁸ cm⁻² range. For the O₂ cooled samples, on the other hand, many interface SPSs were formed irrespective of the oxidation temperature. This is attributed to the low-temperature oxidation during the cooling process after oxidation.
Rights: © 2023 Author(s).
All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license.
URI: http://hdl.handle.net/2433/286493
DOI(Published Version): 10.1063/5.0162610
Appears in Collections:Journal Articles

Show full item record

Export to RefWorks


Export Format: 


This item is licensed under a Creative Commons License Creative Commons