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ファイル | 記述 | サイズ | フォーマット | |
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j.elecom.2023.107575.pdf | 2.03 MB | Adobe PDF | 見る/開く |
タイトル: | Reductive deposition of aluminum at a water-free ionic liquid/oil interface |
著者: | Yoshida, Naohiro Kuroyama, Yohei Yokoyama, Yuko ![]() ![]() ![]() Sakka, Tetsuo ![]() ![]() ![]() Nishi, Naoya ![]() ![]() ![]() |
著者名の別形: | 吉田, 尚弘 黒山, 遥平 横山, 悠子 作花, 哲夫 西, 直哉 |
キーワード: | ITIES Ionic liquid/oil interface Electroless deposition |
発行日: | Nov-2023 |
出版者: | Elsevier BV |
誌名: | Electrochemistry Communications |
巻: | 156 |
論文番号: | 107575 |
抄録: | The oil/water interface has been used as a reaction field for interfacial metal deposition via electron transfer between metal ions and reducing agents across the interface. However, the metals that can be deposited at liquid/liquid interfaces are limited to noble metals whose standard redox potential is more positive than that of water. In the present study, we designed a water-free liquid/liquid interface between a hydrophilic ionic liquid (IL) and oil (O) and succeeded in reductively depositing Al, a base metal that has a significantly negative standard redox potential and that is not reduced at water-based liquid/liquid interfaces. The morphology of the deposited Al was investigated and the reaction mechanism was explained as a combination of electron transfer and ion transfer across the IL/O interface. |
著作権等: | © 2023 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY license. |
URI: | http://hdl.handle.net/2433/287233 |
DOI(出版社版): | 10.1016/j.elecom.2023.107575 |
出現コレクション: | 学術雑誌掲載論文等 |
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