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タイトル: Adhesion behavior of dewatered sewage sludge during indirect thermal drying
著者: Yoo, Junyeong
Oshita, Kazuyuki  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0002-2193-3366 (unconfirmed)
Kusakabe, Taketoshi
Takaoka, Masaki  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0002-6088-8326 (unconfirmed)
著者名の別形: 大下, 和徹
高岡, 昌輝
キーワード: Extracellular polymeric substances
Maillard reaction
Peel test
Shear test
Thermal drying
発行日: May-2025
出版者: Elsevier BV
誌名: Journal of environmental management
巻: 381
抄録: We comprehensively investigated the factors influencing sludge adhesion during indirect thermal drying. We analyzed sludge properties and assessed adhesion during thermal drying using peel and shear tests at temperatures ranging from 100 to 180 °C. We conducted a comparative analysis of sludge properties and adhesion, exploring their correlations. Additionally, we examined the relationship between sludge adhesion and changes in extracellular polymeric substances (EPSs) throughout the drying process. The results indicate that factors leading to increased sludge adhesiveness include higher drying temperatures and the initial soluble EPS (S-EPS) concentration (R > 0.88). Only the S-EPS concentration showed an initial increase during thermal drying, followed by a decrease. Sludge with higher initial S-EPS concentrations released more S-EPS during the early stages of thermal drying. Sludge adhesion tended to increase after the S-EPS concentration began to decline. These observations suggest that the adhesive properties of sludge are not directly related to S-EPS but rather to the heat-induced release and transformation of organic content into substances that enhance adhesion. Potential technical solutions to mitigate sludge adhesion include lowering the drying temperature or reducing the S-EPS concentration through anaerobic digestion.
著作権等: © 2025 The Authors.
Published by Elsevier Ltd.
This is an open access article under the CC BY license ( http://creativecommons.org/licenses/by/4.0/ ).
URI: http://hdl.handle.net/2433/294339
DOI(出版社版): 10.1016/j.jenvman.2025.125203
PubMed ID: 40186975
出現コレクション:学術雑誌掲載論文等

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