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Title: Formation of Cu-Sn alloy layer by contact deposition using quaternary ammonium-imide-type ionic liquid
Authors: Katase, T
Kurosaki, R
Murase, K  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0002-7564-9416 (unconfirmed)
Hirato, T  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0003-3030-1632 (unconfirmed)
Awakura, Y
Issue Date: 2006
Publisher: ELECTROCHEMICAL SOC INC
Journal title: ELECTROCHEMICAL AND SOLID STATE LETTERS
Volume: 9
Issue: 4
Start page: C69
End page: C72
URI: http://hdl.handle.net/2433/34929
DOI(Published Version): 10.1149/1.2171814
Link: Web of Science
Appears in Collections:Graduate School of Engineering Literature Database

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