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| 書誌情報 | ファイル |
|---|---|
| Concentrated Aqueous Solution of Chromium Dichloride for Chromium Metal Electrodeposition Matsumoto, Kazuhiko; Zhang, Jingyuan; Yoneda, Nozomi; Numata, Koma; Okuno, Kazuki; Hagiwara, Rika (2022-08-25) The Journal of Physical Chemistry C, 126(33): 14346-14352 |  |
| Silicon electrodeposition in a water-soluble KF-KCl molten salt: Utilization of SiCl₄ as Si source Yasuda, Kouji; Maeda, Kazuma; Hagiwara, Rika; Homma, Takayuki; Nohira, Toshiyuki (2016-12-20) Journal of The Electrochemical Society, 164(2): D67-D71 | |
| Synthesis of carbon nanotube/Ni nanocomposite film by electrophoresis and electroless deposition without Pd pretreatment Hakamada, Masataka; Moriguchi, Akitoshi; Matsumura, Satoshi; Mabuchi, Mamoru (2013-03) Thin Solid Films, 531: 99-102 | |
| Nano-anchor effect by anodic oxidation of aluminum sheets in joining by electrodeposition Hakamada, Masataka; Miyazawa, Naoki; Kohashi, Yohei; Yamano, Yuriko; Mabuchi, Mamoru (2018) Procedia Manufacturing, 15: 1416-1421 | |
| ジメチルスルホン浴を用いたアルミニウム複合めっき 平藤, 哲司 (2014-02-01) 表面技術, 65(2): 73-76 | |
| Electroplating of Al on Mg alloy in a dimethyl sulfone-aluminum chloride bath Miyake, Masao; Fujii, Hisashi; Hirato, Tetsuji (2015-09-15) Surface and Coatings Technology, 277: 160-164 | |
| Electrodeposition of Aluminum from 1,3-Dimethyl-2-Imidazolidinone/AlCl₃ baths Endo, Atsushi; Miyake, Masao; Hirato, Tetsuji (2014-08-10) Electrochimica Acta, 137: 470-475 | |
| Silicon Eelectrodeposition in a water-soluble KF–KCl Molten salt: effects of temperature and current density Yasuda, Kouji; Saeki, Kazumi; Kato, Tomonori; Hagiwara, Rika; Nohira, Toshiyuki (2018-12-28) Journal of the Electrochemical Society, 165(16): D825-D831 | |
| Novel inorganic ionic liquids possessing low melting temperatures and wide electrochemical windows: Binary mixtures of alkali bis(fluorosulfonyl)amides Kubota, Keigo; Nohira, Toshiyuki; Goto, Takuya; Hagiwara, Rika (2008-12) Electrochemistry Communications, 10: 1886-1888 | |
| Dissimilar joining of alumina to aluminum at room temperature without applying a loading by two-step deposition Naito, Koji; Deguchi, Soichiro; Hakamada, Masataka; Mabuchi, Mamoru (2021-03-01) Materials Letters, 286 | |