|Title:||High-precision alignment and bonding system for the fabrication of 3-D nanostructures|
|Publisher:||IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC|
|Journal title:||Journal of Microelectromechanical Systems|
|Rights:||(c)2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Journal Articles|
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