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| Title: | Cross comparison of thin-film tensile-testing methods examined using single-crystal silicon, polysilicon, nickel, and titanium films |
| Authors: | Tsuchiya, T    https://orcid.org/0000-0002-7846-5831 (unconfirmed)Hirata, M Chiba, N Udo, R Yoshitomi, Y Ando, T Sato, K Takashima, K Higo, Y Saotome, Y Ogawa, H Ozaki, K |
| Keywords: | mechanical properties standardization tensile testing thin film |
| Issue Date: | 2005 |
| Publisher: | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| Journal title: | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS |
| Volume: | 14 |
| Issue: | 5 |
| Start page: | 1178 |
| End page: | 1186 |
| URI: | http://hdl.handle.net/2433/7947 |
| DOI(Published Version): | 10.1109/JMEMS.2005.851820 |
| Link: | Web of Science |
| Appears in Collections: | Graduate School of Engineering Literature Database |
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