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Title: Electroless nickel plating onto minute patterns of copper using Ti(III) redox couple
Authors: Yagi, S
Murase, K  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0002-7564-9416 (unconfirmed)
Tsukimoto, S
Hirato, T  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0003-3030-1632 (unconfirmed)
Awakura, Y
Issue Date: 2005
Publisher: ELECTROCHEMICAL SOC INC
Journal title: JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume: 152
Issue: 9
Start page: C588
End page: C592
URI: http://hdl.handle.net/2433/8278
DOI(Published Version): 10.1149/1.1973244
Link: Web of Science
Appears in Collections:Graduate School of Engineering Literature Database

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