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| 書誌情報 | ファイル |
|---|---|
| Effect of residual stress on delamination from interface edge between nano-films Kitamura, T; Hirakata, H; Itsuji, T (2003) ENGINEERING FRACTURE MECHANICS, 70(15): 2089-2101 | |
| Experimental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a substrate Shang, F; Kitamura, T; Hirakata, H; Kanno, I; Kotera, H; Terada, K (2005) INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 42(5-6): 1729-1741 | |
| Crack initiation at free edge of interface between thin films in advanced LSI Kitamura, T; Shibutani, T; Ueno, T (2002) ENGINEERING FRACTURE MECHANICS, 69(12): 1289-1299 | |
| Cohesive Zone Model Applied to Creep Crack Initiation at an Interface Edge between Submicron Thick Films Truong, Do Van; Kitamura, Takayuki (2010) INTERNATIONAL JOURNAL OF DAMAGE MECHANICS, 19(3): 301-319 |
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