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Experimental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a substrate Shang, F; Kitamura, T; Hirakata, H; Kanno, I; Kotera, H; Terada, K (2005) INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 42(5-6): 1729-1741 | |
Crystal orientation and microstructure of CeO2 thin films grown on biaxially textured metallic substrates Matsumoto, K; Shii, H; Inchinose, A; Adachi, H; Yoshida, Y; Horii, S; Mukaida, M; Osamura, K (2004) JOURNAL OF THE JAPAN INSTITUTE OF METALS, 68(9): 730-736 | |
Thermoelectric properties of CoSi thin films Adachi, K; Ito, K; Zhang, LT; Yamaguchi, M (2003) THERMEC'2003, PTS 1-5, 426-4: 3445-3450 | |
Microstructure and field angle dependence of critical current densities in REBa2Cu3Oy thin films prepared by PLD method Ichino, Y; Honda, R; Miura, M; Itoh, M; Yoshida, Y; Takai, Y; Matsumoto, K; Mukaida, M; Ichinose, A; Horii, S (2005) IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 15(2): 3730-3733 | |
Crack initiation at free edge of interface between thin films in advanced LSI Kitamura, T; Shibutani, T; Ueno, T (2002) ENGINEERING FRACTURE MECHANICS, 69(12): 1289-1299 | |
Growth of high-quality ErBa2Cu3O7-delta thin films Ohazama, T; Mukaida, M; Ichinose, A; Matsumoto, K; Yoshida, Y; Horii, S; Saito, A; Ohshima, S (2004) PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, 412-14: 1301-1305 | |
Cohesive Zone Model Applied to Creep Crack Initiation at an Interface Edge between Submicron Thick Films Truong, Do Van; Kitamura, Takayuki (2010) INTERNATIONAL JOURNAL OF DAMAGE MECHANICS, 19(3): 301-319 | |
Second-harmonic generation in CuCl nanocrystal-embedded short amorphous indium tin oxide thin film Tanaka, K; Corbari, C; Kazansky, PG; Sasai, J; Hirao, K (2003) JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 42(11): 6931-6932 | |
Lithium ion transfer at carbon thin film electrode/electrolyte interface Abe, T; Yamate, S; Iriyama, Y; Inaba, M; Ogumi, Z; Fukutsuka, T (2002) MOLECULAR CRYSTALS AND LIQUID CRYSTALS, 388: 555-560 |
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