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transele.E96.C.454.pdf1.46 MBAdobe PDF見る/開く
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dc.contributor.authorIMAGAWA, Takashien
dc.contributor.authorTSUTSUI, Hiroshien
dc.contributor.authorOCHI, Hiroyukien
dc.contributor.authorSATO, Takashien
dc.contributor.alternative今川, 隆司ja
dc.contributor.alternative佐藤, 高史ja
dc.date.accessioned2013-09-11T06:43:51Z-
dc.date.available2013-09-11T06:43:51Z-
dc.date.issued2013-04-
dc.identifier.issn0916-8516-
dc.identifier.urihttp://hdl.handle.net/2433/178694-
dc.description.abstractThis paper proposes a novel method to determine a priority for applying selective triple modular redundancy (selective TMR) against single event upset (SEU) to achieve cost-effective reliable implementation of application circuits onto coarse-grained reconfigurable architectures (CGRAs). The priority is determined by an estimation of the vulnerability of each node in the data flow graph (DFG) of the application circuit. The estimation is based on a weighted sum of the node parameters which characterize impact of the SEU in the node on the output data. This method does not require time-consuming placement-and-routing processes, as well as extensive fault simulations for various triplicating patterns, which allows us to identify the set of nodes to be triplicated for minimizing the vulnerability under given area constraint at the early stage of design flow. Therefore, the proposed method enables us efficient design space exploration of reliability-oriented CGRAs and their applications.en
dc.format.mimetypeapplication/pdf-
dc.language.isoeng-
dc.publisherThe Institute of Electronics, Information and Communication Engineersen
dc.rights© 2013 The Institute of Electronics, Information and Communication Engineersen
dc.subjectsoft erroren
dc.subjectsingle event upseten
dc.subjecttriple modular redundancyen
dc.subjectreliabilityen
dc.subjectsimulated annealingen
dc.titleA Cost-Effective Selective TMR for Coarse-Grained Reconfigurable Architectures Based on DFG-Level Vulnerability Analysisen
dc.typejournal article-
dc.type.niitypeJournal Article-
dc.identifier.ncidAA10826261-
dc.identifier.jtitleIEICE Transactions on Electronicsen
dc.identifier.volumeE96.C-
dc.identifier.issue4-
dc.identifier.spage454-
dc.identifier.epage462-
dc.relation.doi10.1587/transele.E96.C.454-
dc.textversionpublisher-
dc.relation.urlhttp://www.ieice.org/jpn/index.html-
dcterms.accessRightsopen access-
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