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タイトル: Stabilization of Loess Using Nano-SiO₂
著者: Kong, Ran
Zhang, Fanyu
Wang, Gonghui
Peng, Jianbing
著者名の別形: 王, 功輝
キーワード: loess
nano-loess
nano-SiO2
strength enhancement
structure modification
strength enhancement
structure modification
発行日: Jun-2018
出版者: MDPI AG
誌名: Materials
巻: 11
号: 6
論文番号: 1014
抄録: Improving the performance of loess is of significant importance for lowering its collapsibility and water sensitivity to construction requirements and for geohazard mitigation. The present paper studies the changes in mechanical, structural, and mineralogical properties of nano-SiO₂-treated loess with different contents and curing days. The mechanical behavior was examined by unconfined compressive strength (UCS) of untreated and treated loess. To better understand the mechanisms of stabilization, particle size distributions, scanning electron microscope (SEM) images, and X-ray diffraction (XRD) analyses were carried out. The results show that the UCS increase with increasing contents and curing days due to nano-SiO₂ addition produced coarser particles, denser packing, and smaller pores in treated loess. The changes in the properties can be attributed to the formation of aggregation and agglomeration, with greater particle sizes and more interparticle contact. In addition, the results from mineralogical component analysis further confirm that physical structure modification controls the changes in mechanical and fabric properties, rather than chemical component alteration. Even small nano-SiO₂ additions can also provide great improvement when curing days are enough for the treated loess. These findings reveal that nano-SiO₂ has the potential to serve as a cost-effective stabilized additive that treats the universal loess.
著作権等: This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
URI: http://hdl.handle.net/2433/232987
DOI(出版社版): 10.3390/ma11061014
PubMed ID: 29904025
出現コレクション:学術雑誌掲載論文等

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