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dc.contributor.authorInoue, Ryoichien
dc.contributor.authorTanabe, Katsuakien
dc.contributor.alternative井上, 諒一ja
dc.contributor.alternative田辺, 克明ja
dc.date.accessioned2019-05-31T05:49:12Z-
dc.date.available2019-05-31T05:49:12Z-
dc.date.issued2019-05-13-
dc.identifier.issn0003-6951-
dc.identifier.urihttp://hdl.handle.net/2433/241675-
dc.description.abstractDirectly bonded ohmic InP/Si heterostructures are realized, overcoming the large (8%) lattice mismatch. By employing proper semiconductor surface pretreatments including cleaning and oxide removal, we obtain ohmic interfacial electrical characteristics at a bonding temperature as low as 200 °C. Among the doping-polarity combinations, ohmic interfacial electrical characteristics are observed for n-InP/n-Si and n-InP/p-Si bonded heterointerfaces, but not for p-InP/p-Si and p-InP/n-Si pairs. We numerically explain this polarity dependence in terms of energy band connections across the InP/Si heterointerfaces. The highly conductive III–V/Si direct bonding technique developed in this study is applicable for various heterostructured optoelectronic devices, such as multijunction solar cells and photonic integrated circuits.en
dc.format.mimetypeapplication/pdf-
dc.language.isoeng-
dc.publisherAmerican Institute of Physics Inc.en
dc.rightsThis article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. This article appeared in Appl. Phys. Lett. 114, 191101 (2019) and may be found at https://doi.org/10.1063/1.5092436en
dc.rightsThe full-text file will be made open to the public on 13 May 2020 in accordance with publisher's 'Terms and Conditions for Self-Archiving'.en
dc.titleOhmic InP/Si direct-bonded heterointerfacesen
dc.typejournal article-
dc.type.niitypeJournal Article-
dc.identifier.jtitleApplied Physics Lettersen
dc.identifier.volume114-
dc.relation.doi10.1063/1.5092436-
dc.textversionpublisher-
dc.identifier.artnum191101-
dc.addressDepartment of Chemical Engineering, Kyoto Universityen
dc.addressDepartment of Chemical Engineering, Kyoto Universityen
dcterms.accessRightsopen access-
datacite.date.available2020-05-13-
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