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| ファイル | 記述 | サイズ | フォーマット | |
|---|---|---|---|---|
| 2.0871910jes.pdf | 1.7 MB | Adobe PDF | 見る/開く |
完全メタデータレコード
| DCフィールド | 値 | 言語 |
|---|---|---|
| dc.contributor.author | Adachi, Ken | en |
| dc.contributor.author | Kitada, Atushi | en |
| dc.contributor.author | Fukami, Kazuhiro | en |
| dc.contributor.author | Murase, Kuniaki | en |
| dc.contributor.alternative | 北田, 敦 | ja |
| dc.contributor.alternative | 深見, 一弘 | ja |
| dc.contributor.alternative | 邑瀬, 邦明 | ja |
| dc.date.accessioned | 2019-06-19T04:54:43Z | - |
| dc.date.available | 2019-06-19T04:54:43Z | - |
| dc.date.issued | 2019-06-11 | - |
| dc.identifier.issn | 0013-4651 | - |
| dc.identifier.uri | http://hdl.handle.net/2433/241762 | - |
| dc.description.abstract | We report a novel, cyanide-free, and low-cost displacement silver (Ag) plating bath, i.e., AgCl-dissolved highly concentrated CaCl2/LiCl aqueous solution. Compared to dilute CaCl2/LiCl solutions, this aqueous solution exhibited much higher AgCl solubility because of the high activity of Cl–; the maximum AgCl solubility was achieved at 44.4 mmol dm–3 (i.e., [Ag(I)] = 8.07 g kg−1 H2O). Smooth Ag deposits with a lusterless gray-colored appearance were successfully obtained by displacement plating on a Cu substrate. The mechanism of smooth Ag plating is discussed in terms of its electrochemical and diffusive properties. | en |
| dc.format.mimetype | application/pdf | - |
| dc.language.iso | eng | - |
| dc.publisher | The Electrochemical Society | en |
| dc.rights | © The Author(s) 2019. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited. | en |
| dc.subject | Electrodeposition - electroless | en |
| dc.subject | Concentrated aqueous solution | en |
| dc.subject | Electroless deposition | en |
| dc.subject | Silver plating | en |
| dc.title | Cyanide-Free Displacement Silver Plating Using Highly Concentrated Aqueous Solutions of Metal Chloride Salts | en |
| dc.type | journal article | - |
| dc.type.niitype | Journal Article | - |
| dc.identifier.jtitle | Journal of The Electrochemical Society | en |
| dc.identifier.volume | 166 | - |
| dc.identifier.issue | 10 | - |
| dc.identifier.spage | D409 | - |
| dc.identifier.epage | D414 | - |
| dc.relation.doi | 10.1149/2.0871910jes | - |
| dc.textversion | publisher | - |
| dcterms.accessRights | open access | - |
| datacite.awardNumber | 19H02490 | - |
| jpcoar.funderName | 日本学術振興会 | ja |
| jpcoar.funderName.alternative | Japan Society for the Promotion of Science (JSPS) | en |
| 出現コレクション: | 学術雑誌掲載論文等 | |
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