<Original>Physical Properties of Low-density Particleboard

Abstract

Low-density particleboards bonded with an isocyanate compound adhesive were produced in a full-scale size and their physical properties were examined. The density of the raw materials (Shorea spp.) was 0.4 g/cm^3 and those of the boards 0.3-0.5 g/cm^3. Therefore, the compaction ratios of the boards were in the range of 0.75-1.25. The results obtained are as follows; 1) Bending strength in dry condition of boards with air-dry density 0.4 g/cm^3 was 100 kg/cm^2 which is higher than that of Type 100 particleboard denned by JIS A-5908. This can be much improved by overlaying veneers on the particleboard. 2) Internal bond strength of boards was relatively high, in spite of the low compaction ratios. 3) High dimensional stability both in the plane and in the thickness directions of board was obtained on account of the low compaction ratio and the high water resistivity of the adhesive.