このアイテムのアクセス数: 408

このアイテムのファイル:
ファイル 記述 サイズフォーマット 
KJ00000737476.pdf669.17 kBAdobe PDF見る/開く
タイトル: Dry-heat Degradation of Plywood-type Joint
著者: SASAKI, Hikaru
KANEDA, Hiromu
MAKU, Takamaro
発行日: 31-Mar-1976
出版者: Wood Research Institute, Kyoto University
誌名: Wood research : bulletin of the Wood Research Institute Kyoto University
巻: 59/60
開始ページ: 58
終了ページ: 69
抄録: In order to predict the service life of plywood heating floors, dry-heat exposure test of lauan plywood made with each of six type of typical wood adhesives was carried out at 50°, 70°, 100° and 150℃ for 250 days. Internal bond strength and location of failure of the exposed specimens were measured at selected intervals. Data were plotted as a function of the exposed time. Confidence limit was applied on the regression and the service life was calculated by extraporating the lower confidence limit curve to the half-strength. The apparent mechanism of dry-heat degradation of plywood in 150° and 100℃ seemed to differ from the lower temperature exposures. On 70° and 50℃, more conservative estimation was made by the kinetic method on the Arrhenius relationship. The result showed the detrimental effect of the acid catalyst on polyvinyl-acetate cross-linked and urea resin adhesives. Plywood specimens produced with melamine, phenol, phenol-resorcinol, and resorcinol resin adhesives showed excellent durability in dry-heat exposure at temperature normally found in service of floor heating.
記述: この論文は国立情報学研究所の学術雑誌公開支援事業により電子化されました。
URI: http://hdl.handle.net/2433/53428
出現コレクション:No.59/60

アイテムの詳細レコードを表示する

Export to RefWorks


出力フォーマット 


このリポジトリに保管されているアイテムはすべて著作権により保護されています。