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タイトル: Effect of joining temperature on the microstructure and strength of tungsten/ferritic steel joints diffusion bonded with a nickel interlayer
著者: Zhong, Zhihong
Jung, Hun-chea
Hinoki, Tatsuya  kyouindb  KAKEN_id
Kohyama, Akira
著者名の別形: 檜木, 達也
キーワード: Tungsten
Ferritic steel
Diffusion bonding
Microstructure
Joint strength
発行日: 1-Oct-2010
出版者: Elsevier B.V.
誌名: Journal of Materials Processing Technology
巻: 210
号: 13
開始ページ: 1805
終了ページ: 1810
抄録: A diffusion bonding process, for joining of tungsten to ferritic steel using nickel as an interlayer, was developed for nuclear component application. The effect of joining temperature on the microstructure and tensile strength of the joint was investigated in this work. Metallographic analysis revealed that a good bonding was obtained at both the tungsten/nickel and nickel/steel interfaces, and the diffusion products were identified in the diffusion zone. Nano-indentation test across the joining interfaces demonstrated the effect of solid solution hardening in the diffusion zone. Tensile test showed that the maximum average tensile strength of not, vert, similar200 MPa was obtained for the joint diffusion bonded at 900 °C. The results were discussed in terms of the joining temperature and of the residual stress generated during joining process.
著作権等: © 2010 Elsevier B.V.
This is not the published version. Please cite only the published version. この論文は出版社版でありません。引用の際には出版社版をご確認ご利用ください。
URI: http://hdl.handle.net/2433/128928
DOI(出版社版): 10.1016/j.jmatprotec.2010.06.012
出現コレクション:学術雑誌掲載論文等

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