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Title: Effect of joining temperature on the microstructure and strength of tungsten/ferritic steel joints diffusion bonded with a nickel interlayer
Authors: Zhong, Zhihong
Jung, Hun-chea
Hinoki, Tatsuya  kyouindb  KAKEN_id
Kohyama, Akira
Author's alias: 檜木, 達也
Keywords: Tungsten
Ferritic steel
Diffusion bonding
Microstructure
Joint strength
Issue Date: 1-Oct-2010
Publisher: Elsevier B.V.
Journal title: Journal of Materials Processing Technology
Volume: 210
Issue: 13
Start page: 1805
End page: 1810
Abstract: A diffusion bonding process, for joining of tungsten to ferritic steel using nickel as an interlayer, was developed for nuclear component application. The effect of joining temperature on the microstructure and tensile strength of the joint was investigated in this work. Metallographic analysis revealed that a good bonding was obtained at both the tungsten/nickel and nickel/steel interfaces, and the diffusion products were identified in the diffusion zone. Nano-indentation test across the joining interfaces demonstrated the effect of solid solution hardening in the diffusion zone. Tensile test showed that the maximum average tensile strength of not, vert, similar200 MPa was obtained for the joint diffusion bonded at 900 °C. The results were discussed in terms of the joining temperature and of the residual stress generated during joining process.
Rights: © 2010 Elsevier B.V.
この論文は出版社版でありません。引用の際には出版社版をご確認ご利用ください。
This is not the published version. Please cite only the published version.
URI: http://hdl.handle.net/2433/128928
DOI(Published Version): 10.1016/j.jmatprotec.2010.06.012
Appears in Collections:Journal Articles

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