Dissimilar joining of alumina to aluminum at room temperature without applying a loading by two-step deposition

Abstract

Low temperature joining is desirable for aluminum-ceramics joining because aluminum has a large coefficient of thermal expansion. In the present work, joining of Al₂O₃ to Al was performed at room temperature by the two-step deposition method including Ni electroless deposition and Cu electrodeposition. The joining strength was increased, and the fracture mode changed from a fracture at the Ni/Al₂O₃ interface to that in the Al₂O₃ substrate by using a porous Al₂O₃ or by etching a dense Al₂O₃ surface. Thus, the present work demonstrates that Al₂O₃ and Al are successfully joined at room temperature without applying a load by the deposition method.