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dc.contributor.authorTsuchiya, Toshiyukien
dc.contributor.authorMatsui, Yukien
dc.contributor.authorHirai, Yoshikazuen
dc.contributor.authorTabata, Osamuen
dc.contributor.alternative土屋, 智由ja
dc.contributor.alternative松井, 祐樹ja
dc.contributor.alternative平井, 義和ja
dc.contributor.alternative田畑, 修ja
dc.date.accessioned2023-08-24T06:01:48Z-
dc.date.available2023-08-24T06:01:48Z-
dc.date.issued2017-
dc.identifier.isbn9781538627327-
dc.identifier.urihttp://hdl.handle.net/2433/284801-
dc.description2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 18-22 June 2017.en
dc.description.abstractThermomechanical noise of arrayed capacitive accelerometers with sub-micrometer sensing electrodes was evaluated. The unit accelerometer of the array was 80-μm square, designed as a proportional scale-down of a conventional single-axis accelerometer. Since the size effect shows the capacitance sensitivity per unit volume increases by proportional downsizing, a 10-by-10 array of the one-tenth sized unit accelerometer would have the same sensitivity of a single accelerometer of same occupied area. However, the thermomechanical noise needs to be controlled and reduced by vacuum encapsulation because size reduction causes noise increase. By measuring the electrical impedance at the resonant frequency, the damping coefficient was estimated using electrical equivalent circuit modeling. The estimated thermomechanical noise was reduced below 3 μg√VHZ by encapsulating at 100 Pa, which is low enough for instrumentation applications.en
dc.language.isoeng-
dc.publisherIEEEen
dc.rights© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.rightsThis is not the published version. Please cite only the published version. この論文は出版社版でありません。引用の際には出版社版をご確認ご利用ください。en
dc.subjectCapacitive accelerometer arrayen
dc.subjectequivalent circuiten
dc.subjectsize effecten
dc.subjectsqueezed film dampingen
dc.subjectthermomechanical noiseen
dc.titleThermomechanical noise of arrayed capacitive accelerometers with 300-NM-gap sensing electrodesen
dc.typeconference paper-
dc.type.niitypeConference Paper-
dc.identifier.jtitle2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)en
dc.identifier.spage1002-
dc.identifier.epage1005-
dc.relation.doi10.1109/TRANSDUCERS.2017.7994220-
dc.textversionauthor-
dcterms.accessRightsopen access-
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