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dc.contributor.authorKatase, Tja
dc.contributor.authorKurosaki, Rja
dc.contributor.authorMurase, Kja
dc.contributor.authorHirato, Tja
dc.contributor.authorAwakura, Yja
dc.date.accessioned2007-03-28T05:38:50Z-
dc.date.available2007-03-28T05:38:50Z-
dc.date.issued2006ja
dc.identifier.issn1099-0062ja
dc.identifier.urihttp://hdl.handle.net/2433/34929-
dc.language.isoengja
dc.publisherELECTROCHEMICAL SOC INCja
dc.titleFormation of Cu-Sn alloy layer by contact deposition using quaternary ammonium-imide-type ionic liquidja
dc.type.niitypeJournal Articleja
dc.identifier.jtitleELECTROCHEMICAL AND SOLID STATE LETTERSja
dc.identifier.volume9ja
dc.identifier.issue4ja
dc.identifier.spageC69ja
dc.identifier.epageC72ja
dc.relation.doi10.1149/1.2171814ja
dc.textversionnoneen
Appears in Collections:Graduate School of Engineering Literature Database

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