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j.jallcom.2009.09.105.pdf2.17 MBAdobe PDF見る/開く
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dc.contributor.authorZhong, Zhihongja
dc.contributor.authorHinoki, Tatsuyaja
dc.contributor.authorNozawa, Takashija
dc.contributor.authorPark, Yi-Hyunja
dc.contributor.authorKohyama, Akiraja
dc.contributor.alternative檜木, 達也ja
dc.date.accessioned2009-12-25T02:56:05Z-
dc.date.available2009-12-25T02:56:05Z-
dc.date.issued2010-10ja
dc.identifier.issn09258388ja
dc.identifier.urihttp://hdl.handle.net/2433/89645-
dc.description.abstractDiffusion bonding between W and ferritic/martensitic steel F82H using a Ti interlayer was carried out in vacuum at temperature range of 850–950 °C for 1 h with 10 MPa. Metallographic analysis with field-emission scanning electron microscopy revealed excellent bonding at both W/Ti and Ti/F82H interfaces. The chemical compositions of the reaction products were analyzed by energy dispersive spectroscopy and their existence were confirmed by X-ray diffraction technique. α–β Ti solid solution was detected at W/Ti interface, while the reaction phases at Ti/F82H interface are dependent on the joining temperature. Joint strength was evaluated and the variations in strength of the joints were significantly related to the microstructural evolution of the diffusion zone. All the joints fractured at Ti/F82H interface during shear testing. The hardness distribution across the joining interfaces was also determined.ja
dc.language.isoengja
dc.publisherElsevierja
dc.rightsc 2009 Elsevier B.V. All rights reserved.ja
dc.rightsThis is not the published version. Please cite only the published version. この論文は出版社版でありません。引用の際には出版社版をご確認ご利用ください。ja
dc.subjectDiffusion bondingja
dc.subjectMicrostructureja
dc.subjectSteelja
dc.subjectTitaniumja
dc.subjectTungstenja
dc.titleMicrostructure and mechanical properties of diffusion bonded joints between tungsten and F82H steel using a titanium interlayerja
dc.type.niitypeJournal Articleja
dc.identifier.jtitleJournal of Alloys and Compoundsja
dc.identifier.volume489ja
dc.identifier.issue2ja
dc.identifier.spage545ja
dc.identifier.epage551ja
dc.relation.doi10.1016/j.jallcom.2009.09.105ja
dc.textversionauthorja
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