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| 書誌情報 | ファイル |
|---|---|
| Applicability of fracture mechanics on brittle delamination of nanoscale film edge Kitamura, T; Hirakata, H; Satake, Y (2004) JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, 47(2): 106-112 | |
| Effect of residual stress on delamination from interface edge between nano-films Kitamura, T; Hirakata, H; Itsuji, T (2003) ENGINEERING FRACTURE MECHANICS, 70(15): 2089-2101 | |
| Ideal strength of nano-components Kitamura, T; Umeno, Y; Kushima, A (2005) MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE IV, 482: 25-32 | |
| Effect of loading frequency on fatigue crack growth between a submicron-thick film and a substrate Van Truong, D; Hirakata, H; Kitamura, T (2006) JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, 49(3): 370-375 | |
| Experimental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a substrate Shang, F; Kitamura, T; Hirakata, H; Kanno, I; Kotera, H; Terada, K (2005) INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 42(5-6): 1729-1741 | |
| Crack initiation at free edge of interface between thin films in advanced LSI Kitamura, T; Shibutani, T; Ueno, T (2002) ENGINEERING FRACTURE MECHANICS, 69(12): 1289-1299 |
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