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| 書誌情報 | ファイル |
|---|---|
| Creep crack initiation at a free edge of an interface between submicron thick elements Hirakata, Hiroyuki; Hirako, Toshihiro; Takahashi, Yoshimasa; Matsuoka, Yasunori; Kitamura, Takayuki (2008) ENGINEERING FRACTURE MECHANICS, 75(10): 2907-2920 | |
| Applicability of fracture mechanics on brittle delamination of nanoscale film edge Kitamura, T; Hirakata, H; Satake, Y (2004) JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, 47(2): 106-112 | |
| Effect of residual stress on delamination from interface edge between nano-films Kitamura, T; Hirakata, H; Itsuji, T (2003) ENGINEERING FRACTURE MECHANICS, 70(15): 2089-2101 | |
| Experimental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a substrate Shang, F; Kitamura, T; Hirakata, H; Kanno, I; Kotera, H; Terada, K (2005) INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 42(5-6): 1729-1741 |
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