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書誌情報ファイル
Development of dynamic deployment simulation of thin composite layer for shape morphing structure
  Nishikawa, M.; Nagata, K.; Naito, Y.; Hojo, M.; Matsuda, N. (2017)
  21st International Conference on Composite Materials
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Numerical Analysis of RC Columns Accompanied with Friction Damping Mechanism under Cyclic Loading
  Setiawan, Angga Fajar; Takahashi, Yoshikazu; Kiyono, Junji; Sawada, Sumio (2017)
  Procedia Engineering, 171: 821-835
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Efficiency limiting factors in perovskite solar cells
  Ohkita, Hideo; Kim, Hyung Do (2017)
  The proceedings of AM-FPD 17 : 24th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD): 13-16
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Conservation of historical tumulus mounds using geotechnical engineering techniques
  Sawada, Mai; Mimura, Mamoru; Yoshimura, Mitsugu (2017-09)
  Proceedings of the 6th International Young Geotechnical Engineers’ Conference (iYGEC6): 23-24
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Optimal Hyperpaths with Non-Additive Link Costs
  Maadi, Saeed; Schmöcker, Jan Dirk (2017)
  Transportation Research Procedia, 23: 790-808
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High-resolution Imaging and Separation of Multiple Pedestrians Using UWB Doppler Radar Interferometry with Adaptive Beamforming Technique
  Anabuki, Motoshi; Okumura, Shigeaki; Sakamoto, Takuya; Saho, Kenshi; Sato, Toru; Yoshioka, Mototaka; Inoue, Kenichi; Fukuda, Takeshi; Sakai, Hiroyuki (2017)
  2017 11TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION (EUCAP): 469-473
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Realizing Ultrafine Grained Steel by Simple Hot Deformation Using Dynamic Transformation and Subsequent Dynamic Recrystallization Mechanisms
  Zhao, L; Park, N; Tian, Y; Shibata, A; Tsuji, N (2017-05)
  IOP Conference Series: Materials Science and Engineering, 194
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Thermomechanical noise of arrayed capacitive accelerometers with 300-NM-gap sensing electrodes
  Tsuchiya, Toshiyuki; Matsui, Yuki; Hirai, Yoshikazu; Tabata, Osamu (2017)
  2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS): 1002-1005
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MEMS mirrors for automotive applications
  Tsuchiya, Toshiyuki (2017)
  2017 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK): 82-83
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