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| 書誌情報 | ファイル |
|---|---|
| Nanoscale silicon fluidic transfer for ultrahigh-density self-assembled integration Ishihara, Shoji; Tanabe, Katsuaki (2020-06-01) Nano Express, 1(1) |  |
| Disappearance of stress singularity at interface edge due to nanostructured thin film Sumigawa, Takashi; Hirakata, Hiroyuki; Takemura, Masaki; Matsumoto, Shohel; Suzuki, Motofumi; Kitamura, Takayuki (2008) ENGINEERING FRACTURE MECHANICS, 75(10): 3073-3083 | |
| Creep crack initiation at a free edge of an interface between submicron thick elements Hirakata, Hiroyuki; Hirako, Toshihiro; Takahashi, Yoshimasa; Matsuoka, Yasunori; Kitamura, Takayuki (2008) ENGINEERING FRACTURE MECHANICS, 75(10): 2907-2920 | |
| Selective Transfer of Si Thin-Film Microchips by SiO₂ Terraces on Host Chips for Fluidic Self-Assembly Fujita, Yutaka; Ishihara, Shoji; Nakashima, Yuki; Nishigaya, Kosuke; Tanabe, Katsuaki (2021-03) Applied Mechanics, 2(1): 16-24 | |
| Effect of loading frequency on fatigue crack growth between a submicron-thick film and a substrate Van Truong, D; Hirakata, H; Kitamura, T (2006) JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, 49(3): 370-375 |